Computer Hardware Repair Specialist Resume
Contact information
Bob E. Gottesman
19 Street
Columbus
Ohio
Career objective
Looking for a challenging position of the Computer Hardware Repair Specialist Resume the reputed University with a view to use my wide experience for the benefit of the organization.
Attributes:-
17 Years experience in hi-tech electronics environment with excellent soldering ability
Qualified to ONC level electronics and microelectronics, IPC J standard & IPC 610
Modification and assembly of wring, cables and connectors
Manual assembly and rework of SMT PCB assemblies with BGA and 0402 content
Test rig repair and upkeep, fault find down to component level
Computer skills e.g. Word, Excel and Powerpoint
Generation of basic assembly documentation
Possess excellent time management and communication skills
Self motivated, ability to work unsupervised
A good basic knowledge of electronics together with hands-on electronic laboratory skills
Tasks, Duties and Responsibilities:-
Assembly, modification and rework of development hardware
Assist with the assembly of specialist low volume products
Prototype construction including using SMT components
Maintaining development component stores
Manipulation and presentation of test data in tables, graphs etc
EDUCATION & QUALIFICATIONS
Oakbank School –
1988 -1992
GCSE’s:-
Creative Design, English Literature & Language, Humanities, Information Systems, Mathematics, Science, Technology
City & Guilds D.V.E. in
Building & Construction of the built environment, Desk Top Publishing, Word-Processing
Bradford/ ITEC
1992 - 1994
City & Guilds 7261 Information Technology Diploma – NVQ level 2 & 3
Elementary & Intermediate Electronics (digital)
Elementary & Intermediate Electronics Circuits & Testing (analogue)
Introductory Computers & Computing & Health & Safety
Technical College
1995 - 1997
BTEC (ONC) Electrical & Electronic Engineering yrs 1 & 2
Computer Applications, Electrical & Electronic Principles, Industry & Society, Introduction to Robotics, Mathematics for Engineers, Microelectronics systems
Technical College
2000 - 2001
BTEC (HNC) Electrical & Electronic Engineering (yr 1)
Business & Management, Engineering design
Yorkshire Electronics, Bradford
2002
3 week intensive training course on Advanced Soldering BGA , SMT & Repair, Health and Safety, COSHH
Yorkshire Electronics, Leeds
2007
1 day course on RoHs compliance & training in the use of RoHs solder
EMPLOYMENT HISTORY
October 2010 – Present
(temp contract)
Frames Engineer – BT Openreach
Whilst under training carrying out visits to telephone exchanges throughout to connect up end user to PSTN or ADSL lines using MPF or SMPF. This entails running jumper wire to various points on Main Distribution Frame, terminating on IDC and soldering the blocks then I use telecoms equipment to confirm terminations are correct.
April 2010 – July 2010
(temp contract)
Engineering Technician – Calibre UK
This role involved me training in development carrying out basic changes to electronic designs using easyPC v12, AutoCAD Mechanical 2D & Autodesk Inventor 3D. Within the SMT department I undertook training and could operate the screen printer, Euro placer pick & place machine and Blundell reflow oven. In production I assembled, tested andrepaired electronics, most of the products were professional video & audio image scalers driver boards.
July 2008 – March 2009
Production and Service Engineer – Industrial Monitoring Systems
Electro/mechanical and electronic servicing and repair of portable cleanliness oil monitoring equipment for Pall Corporation, customers included BAE Systems, Royal Navy, M.O.D & Oil industries.
Dec 2005 – June 2008
Hardware Technician – Sarian Systems
Working within Engineering Department I managed and run the Service Department I was responsible for all customerrepairs, fault finding to component level of wired and wireless mobile routers, collation of data and summary reports.Repair of PSTN, ISDN, ADSL, LAN ports, CPU, memory and switch mode PSU’s Exposure to GPRS, Edge, HSDPA and ADSL2+ technologies. Customers included blue chip companies such BP Oil, Fujitsu, T-Mobile and BT.
Mar 2003 – Oct 2005
Electronics Engineer – A Novo GE UK
IPC standard repair on all Pace digital range of cable & satellite STB’s including new Sky+, repairs to switch mode PSU/Video/Audio circuit’s, debugging with the aid of PC diagnostic equipment, PDF schematics, DVM, Digital scopes, Hot air rework station and Microscopes.
Jan 2000 – Jan 2003
Hardware Technician – Eldon Technologies
Working alongside Senior Engineers within R & D facility, testing upgrading and debug of digital televisions e.g. Grundig, Philips and satellite equipment for Echostar. Prototype building of LCD TFT & CRT display O/P devices. Later moved to component appraisals this involved some analysis of passive components taking temperature, voltage and current measurements to indicate the device is acceptable for use.
July 1993 – Dec 1999
PCB Tester & Repair – Chase Advanced Technologies
Functional testing & ATE testing (Innovate 9000) of Analogue & Digital circuit boards of varied size and complexity,repair of surface mount & conventional components on PCB’s down to component level using electronic schematics with the aid of Analogue scopes & DVM’s. I was subsequently promoted to running returns department for 6 months.
INTERESTS AND HOBBIES
I enjoy playing in the local football team, mountain biking and have a keen interest in aviation. Recently completed sponsored 26 mile Yorkshire Three Peaks Walk August 2010 and achieved it within 12 hours.
References
Bob E. Gottesman
Manager
Wap Company.
Bob_Gottesman@gmail.com
